Illustration of a Wire Bonding Process on Make a GIF

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The input bandwidth of high-speed circuits may be limited by the bond wire inductance and the pad capacitance. Consider two cases: (a) the bond wire diameter is 50 μm and the pad size 100 μm ×100 μm; (b) the bond wire diameter is 25 μm and the pad size 50 μm ×50 μm. If all other dimensions are constant. which case is preferable? | Numerade

Types of Electrical Wires and Cables