The Thin Shrink Small Outline Package (TSSOP) is a rectangular surface mount plastic integrated circuit (IC) package with gull-wing leads.

Thin small outline package (TSOP) is a type of surface mount IC package. They are very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm). They are frequently used …

A thin small-outline package (TSOP) is a rectangular, thin-bodied component. A Type I TSOP has legs protruding from the width portion of the package.

Thin Shrink Small Outline Package (TSSOP) is a rectangular surface mount plastic integrated circuit (IC) package with gull-wing leads. They are suited for applications requiring 1 mm or …

Find the Small Outline (SO) package drawing and specifications such as pin count, pitch and dimension.

2025年1月2日 · 总结而言， SOP封装 及其衍生 封装 形式，如SO、 SOJ 、 SSOP 、 TSOP 和 TSSOP，各有其特点和应用领域。 作为电路设计者和制造者，应充分理解这些 封装 技术参 …

But, consider how modern electronics are always trying to be smaller, faster, and lighter, and you can see why one would use something like TSSOP, or even things like WL-CSP or BGA …

TSSOP-16 Minimum Packing Quantity Quantity Tape Width Part Number Suffix Bulk-Loose 96 — — 13” Reel 2,500 12mm -13 Note: Package quantities given are for minimum packaging …

The Thin Shrink Small Outline Package, or TSSOP, is a rectangular surface mount plastic package with gull-wing leads. It has a smaller body and smaller lead pitch than the standard …

TSSOP (Thin Shrink Small Outline Package) and MSOP (Mini Small Outline Package) are leadframe based, plastic encapsulated packages that are well suited for applications requiring …