2020年6月8日 · COF IC is a flexible Printed packaging technology, which is used for transferring video signal data into the panel. This technology package gives the highest density and high …

We developed a so-called "reel-to-reel method" COF technology using a long carrier tape for the LCD driver package. This method enables mass production of COF. We used the ILB (inner …

2022年4月18日 · Chip On Glass (COG) is the method of placing the driver IC directly on top of the glass substrate. Chip On Film (COF) refers to a film with a thin printed circuit equipped with a …

What’s COF? COF (Chip on Flex) is a display packaging technology, and is also a variation of COB, where a chip is mounted directly to a flex circuit. Unlike COB, it may not use wires nor …

2024年3月18日 · It is the mobile phone screen display driver IC (Display Driver IC, DDIC) directly bonded links in the glass-based rigid glass substrate, and then linked by the FPCB to the rest …

The full name of COF is chip on film, which is different from the traditional COG technology (chip on glass). The main difference between the two is the position of the chip (ie driver ic). COF …

These datasheets serve as your ultimate guide, providing valuable insights and key specifications that are vital for any engineer or technician. They contain detailed information about the Cof …

COF IC, short for Chip – on – Flexible – Interconnect, is an advanced packaging technology. It combines the advantages of flexible printed circuits (FPC) and integrated circuits (IC).

Homray Micron Technology, founded in 2008, is a leading manufacturer and supplier of COF Substrate Film –COF (Chip-On-Film) Tape, COF ILB , COF Driver IC and Reel COF Package …

液晶ドライバ用のパッケージとして長尺テープを使用したリールtoリール方式のCOF技術を開発した。 この方式でCOFの大量生産が可能である。 COFは2層テープ(接着剤レス)上のイン …