Metal Can Packages (TO-3/5/8/18/39/46/52/72) National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.

The TO-52 package finds use in applications where reliability and effective thermal management’s crucial. Characterized by its metal body with a diameter and more prominent cap compared to smaller packages like the TO-18 the TO-52 offers improved thermal …

TO-52 Disclaimer: It is the Buyers responsibility for designing, validating and testing the end application under all field use cases and extreme use conditions. Guaranteeing the application meets required standards, regulatory compliance, and all safety and security requirements is the responsibility of the Buyer.

The TO-52 is a type of 'metal can' package that is hermetically sealed to protect the device from environmental factors such as contaminants and moisture. It is commonly used in housing transistors and integrated circuits with low lead counts such as voltage reference IC's.

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JEDEC TO-52 Package: TopLine Dummy Component: For training, practice and evaluation

to-52 封装形式脚位封装技术介绍。 封装分类. agp; amr; ax14; ax078; bga; c-bend lead; ceramic; cerpack; cerquad

The transistor outline (TO) package family consists of many types of packaging solutions for transistors and similar discrete devices as well as simple IC's with low pin counts. The structures of TO packages vary widely, from expensive metal can enclosures to low-cost plastic-molded package bodies (see Table 1 below). Table 1.

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to-52封装是一种金属封装，通常用于承载各种小尺寸的电子元件，如二极管、晶体管、光电二极管等。 其尺寸会因具体元件的类型和制造商而有所不同，但一般来说，TO-52封装的尺寸约为：