TO-3 - Wikipedia
In electronics, TO-3 is a designation for a standardized metal semiconductor package used for power semiconductors, including transistors, silicon controlled rectifiers, and, integrated circuits. TO stands for "Transistor Outline" and relates to a series of …
Metal Can Packages (TO-3/5/8/18/39/46/52/72) National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
TO-3 Package
The TO-3 or TO3 is a type of 'metal can' package that is capable of high-power dissipation commonly used by power transistors, SCR's and other high-power semiconductor devices. The TO-3 is made entirely of metal, with the microchip mounted on its metal can base and then covered with a metal cap .
TO3封装特点_类型_引脚尺寸 - IC先生
Jun 9, 2023 · TO3封装（TO-3 Package）是一种常见的电子元件封装类型，特别用于功率器件和放大器。 TO3代表"Transistor Outline 3"（三引脚晶体管外形），它是由国际电工委员会（IEC）定义的一种标准封装。
【TO】パッケージの『種類 (TO-220やTO-92など)』と『特徴』を …
to-3は パワートランジスタの初期のパッケージ です。 現在ではほとんど使われていません。 TO-3は円筒部分の直径が22.2mm、高さが5.7mm程度の金属パッケージであり、形状は帽子に似ています。
What is the difference between TO-3 and TO-204AA packaging?
Nov 1, 2020 · TO-3 was the older, original designation, but if you've ever opened up old equipment, or just gotten your hands on some older TO-3 power transistors, you'll probably notice they don't quite look like modern TO-3s, and there was a surprising amount of variation between them. Some had thinner or thicker leads, longer leads, different can heights ...
TO-3 Component Package - mbedded.ninja
The TO-3 component package is a family of large through-hole metal can packages used for things such as transistors, linear regulators and op-amps. There are 2 lead (common), 3 lead (common), 8 lead (rare), and 15 lead (very rare) variants. It is similar to the TO-23 component package. Synonyms: TO-204AA (JEDEC TO-3-2L)
TO-3P(N) | 东芝半导体&存储产品中国官网
Download package data for CAD tool, such as 3D model data in STEP format and reference land pattern data designed following JEITA ET-7501 Level3. On this page you can find the dimensions and packing method for Toshiba Semiconductor's TO-3P (N) package.
TO-3 package 封装 - m.838dz.com
Jun 19, 2021 · TO-3 package 封装, 关于我们 | 联系我们 | 免责声明: 838电子资料 China 中文版 : 辽ICP备17001409号-1 辽公网安备21120202000012 辽公网安备21120202000012
TO-3P(N) - Toshiba Electronic Devices & Storage Corporation
Download package data for CAD tool, such as 3D model data in STEP format and reference land pattern data designed following JEITA ET-7501 Level3. On this page you can find the dimensions and packing method for Toshiba Semiconductor's TO-3P (N) package.