The “target” in sputtering target refers to the material that is “hit” or bombarded during deposition. This process is vital for producing thin films, which are essential components in modern devices, from semiconductor chips to optical coatings and solar cells.

VEM supplies state-of-the-art sputtering targets in purities ranging from 99.9% to 99.999+%, including popular targets for all PVD systems; round, rectangular, ConMag, Delta, Ring, Rotatable and multi-tiled. Supporting 150-450mm wafer fabs.

A sputtering target is defined as a source of contamination in the deposition system due to the generation of gaseous, vapor, or particulate matter during the sputtering process, which can arise from second phase particles in the target material.

2024年5月20日 · A negatively charged target material, known as the sputtering target, is placed in the chamber. A high voltage is applied between the target and the substrate, which causes the inert gas to become ionized, creating a plasma.

2022年11月10日 · Ion beam sputtering is a thin film deposition method in which an ion source sputters a target metal or dielectric material onto a substrate. The monoenergetic and highly collimated properties of the ion beam enable precise control of film growth.

A sputtering target is a material generated by PVD to form thin films. In sputtering, an ion beam hitting the surface of the target dislodges atoms or molecules from the target and spews them off into a substrate in a thin film.

Sputtering targets are necessary raw materials used in physical vapor deposition thin film coating. SAM specializes in producing high purity sputtering target with the highest possible density and smallest possible average grain sizes.