A die, in the context of integrated circuits, is a small block of semiconducting material on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches …

The power semiconductor die of a three-terminal device (IGBT, MOSFET or BJT). Two contacts are on top of the die, the remaining one is on the back.

2021年11月10日 · According to AMX, the Micro-Punch tool ensures uniform pressure and eliminates the following high-value issues: die fracture, tilting, delamination, and voids.

2012年7月26日 · Power semiconductors employed in power management systems include power switches, and rectifiers (diodes). Power switches include MOSFETs , IGBTs, and BJTs …

Our SiC die offer unrivaled ruggedness and performance with an oxide lifetime of more than 100 years, a stable body diode and “IGBT-like” short circuit performance.

2023年10月2日 · Semiconductor die is the key to innovation for modern-day electronics. Understanding the intricacies of die and its functionality allows manufacturers to look for …

Sintered die attach is undoubtedly the manufacturing process of choice for power modules that employ (and want to get the most from) SiC dies. The sinter must be as free of voids as …

semiconductor packaging to unpackaged die provides the system designer with opportunities for more efficient use of limited space. At the same time, bare die implementation affords …

Discover how to optimize the thermal performance of power electronics with effective die attach techniques. Read our white paper for best practices.

Die attach materials and sintering processes play a crucial role in the reliability and performance of power electronics. These materials are used to bond semiconductor chips to...