QP Technologies (formerly Quik-Pak) can provide virtually any IC package you need for your prototype devices, such as Open-molded Plastic Packages (OmPP)®, Open Cavity Plastic Packages (OCPP)®, ceramic IC packages, laminate substrates and even custom IC …

Open Cavity Plastic Packages are pre-molded and used for high quality quick turn assembly and packaging needs. Open cavity packages are available in QFN (Quad Flat No-Leads), QFP, SOIC, and SSOP footprints and can be customized for specific applications.

Because peak power levels can vary significantly - from as low as 5 W to over 1 kW - a variety of packaging options is required to accommodate diverse applications. The choice of package format, such as air-cavity or overmolded plastic, typically depends on design requirements and the trade-offs between performance and cost.

SEMPAC, a privately-owned company in the Pacific Northwest / Silicon Forest devoted to the design, development and manufacture of Pre-molded Open Cavity Plastic Packages. SEMPAC exclusively focuses on the development of integrated packaging solutions.

QP Technologies’ Open Cavity Plastic Packages are mechanically and electronically identical to your future production parts. You can insert these prototype packages directly into test sockets and boards, thereby eliminating the risks associated with using nonequivalent packages.

Working with ceramic and plastic materials, we carefully construct open cavity packages that offer excellent thermal dissipation, electrical insulation, and mechanical strength. Whether it’s managing heat efficiently with ceramic packages or cost-effective solutions with plastic packages, we tailor our approach to meet specific requirements.

QP Technologies’ (formerly Quik-Pak) exclusive Open-molded Plastic Package (OmPP) is a pre-molded, air cavity QFN package (Quad Flat No-Lead) designed to provide a high quality, fast solution for your IC packaging and IC assembly needs.

Open cavity plastic packages are a type of packaging used in the electronics industry to protect and encapsulate electronic components. The package is made of plastic material with an open cavity design to allow the component to be inserted and attached to the leads of the package.

Intech Technologies International specializes in cutting-edge plastic packages, providing reliable and innovative solutions for semiconductor packaging needs. Plastic package manufacturing for mass volume production is a widely utilized method in the semiconductor industry.

PQFNs are pre-molded, open cavity packages (Quad Flat No-Lead) designed to provide a high quality, fast solution for your IC packaging and IC assembly needs. They are Au/Ni plated and come in a wide variety of sizes from 3x3mm to 12x12mm with a variety of pitch options.