PCB科技 - PCB製造方法和mSAP的優勢 - PCB, Printed Circuit ...
2022年6月5日 · 隨著新的msap（改良半添加工藝）科技在pcb上的出現，其跡線寬度可以减少一半，達到1.25密耳的水准，囙此可以最大限度地提高電路組裝密度。 現時，集成電路的不斷進步已經從電晶體IC光刻工藝（光刻）轉移到PCB工藝。
mSAP PCB: A Substrate-Bonded Additive Copper Layer ... - PCB …
2024年9月2日 · mSAP (Modified Semi-Additive Process) is an advanced PCB fabrication technology that combines the benefits of Substrate-Bonded PCBs with the precision and flexibility of the additive copper layer fabrication process.
mSAP 封装基板制造工艺简介 - 哔哩哔哩
2024年6月6日 · mSAP 和 Substrative 工艺在制造流程上的主要区别在于： 1. 图形形成方式不同：mSAP 是通过电镀在基板上添加铜层，而 Substrative 工艺是通过蚀刻去除多余的铜层。 2. 工艺复杂性：mSAP 工艺涉及到电镀和干膜剥离等复杂步骤，相比之下 Substrative 工艺的步骤相对简 …
Rethinking the basics of PCB and IC Substrate manufacturing with mSAP
AT&S's mSAP technology enables the highly precise and efficient production of printed circuit boards and IC substrates. The higher density of conductor paths makes the miniaturization of printed circuit boards and thus of electronic devices feasible - ideal for applications in electronics, the automotive industry and medical technology.
mSAP PCB: A Substrate-Bonded Additive Copper Layer ... - Flex PCB
2024年6月20日 · mSAP substrate-bonded PCBs offer a powerful solution for designing and manufacturing high-density, high-performance electronic circuits. By leveraging an additive process to deposit thin copper layers directly onto the dielectric substrate, mSAP enables finer feature sizes, improved signal integrity, and greater reliability compared to ...
PCB Fabrication and Assembly Service: Subtractive vs. mSAP
2024年5月21日 · While both Subtractive and mSAP processes use photolithography to define circuit patterns, differences lie in how each process handles material removal and any further fabrication steps required to complete the PCB. mSAP for instance, incorporates additional additive steps to achieve finer, more precise control over circuit features compared to ...
IC载板SAP半加成法研究-IC封装载板_深圳博锐电路科技有限公司
2023年1月11日 · 采用改良半加成工艺（msap）在薄铜箔层压板上实现密度相对较低的ic载板设计（以及超高密度的pcb，例如手机用pcb）。 SAP半加成法技术可以直接在有机层压 IC载板 材料上制成最精细的线宽/线距结构。
mSAP and SAP: Cutting-Edge PCB Technology | GS Swiss PCB
mSAP and SAP technology are crucial for applications requiring extreme miniaturization, such as IC substrates and smartphones. These technologies are also essential for manufacturing products that need high signal density for superior resolution and precise imaging, like advanced ultrasound and MRI devices.
What mSAP Technology Can Do for Your Advanced Applications
2023年10月2日 · A: Because mSAP technology allows structures in the 20–25-micron line/space range, it’s ideal for high-frequency applications and is commonly used in IC substrate production. It can also offer advantages for interposer PCBs and high-speed PCBs.
Modified Semi-Additive Process - MacDermid Alpha
Our product selection for modified Semi-Additive Process (mSAP) for high density circuitry is increasing yields and enabling new designs. mSAP is a cost-effective process for fine line substrates which allows for a high degree of automation, high yields, and lean manufacturing.