Peck and colleagues gathered reports and studies of the effects of temperature and humidity on the time to failure behavior for a range of epoxy based packages. The model they developed is empirically derived from a large number of different life studies.

哈尔伯格-佩克公式（Hallbery-Peck equation）是阿伦尼乌斯公式的延展，用来计算化学反应速率常数随温度、湿度变化关系的经验公式。 r= (RHS/RHU)n · e (Ea/R)* { (1/Tu)- (1/Ts)} K:速率常数 ，RH:湿度值 ，n:湿度加速常数（通常2~3之间，常取3），A:子前因子 (也称为频率常数)， Ea:表观活化能 ，R:摩尔体积常数，T:热力学温度。 该定理能很好描述实际环境中受温度、湿度双 …

Humidity-related failure mechanisms can be described using the Peck, Hallberg-Peck or Lawson models; For each model, the parameters are adapted to the actual situation. How is the effect of stress quantified? The acceleration models describe, as previously mentioned, the connection between a specific stress and the time to failure.

Hallberg-Peck model may be a suitable candidate for prediction of flexible PV module performance for moisture induced degradation but further scrutiny is warranted due to possible differences.

2017年9月5日 · Humidity Testing can be used to accelerate the aging of products that are affected by ambient humidity levels. Increasing the humidity above the normal use level humidity can cause defects or failures to occur in shorter times than what would be observed in the field.

Accelerated humidity test data on plastic res are analysed, showing higher thermal acceleration and longer life for modem components compared to older ones. Accelerations for total test time in humidity are given, and the effect of assumed moisture ingress …

Humidity is also a stressor. The equation below (Hallberg – Peck) models the effect of temperature and humidity combined on product life. RHu = use environment relative humidity RHt = test environment relative humidity The stressor that has the most profound effect on product life is thermal cycling. The

2017年1月1日 · The model used here to describe the joint effect of temperature and humidity is a model derived from an Arrhenius law for the temperature and an inverse power law for the relative humidity. This model is known as the Hallberg and Peck model.

Accelerated humidity test data on plastic ICs are analysed, showing higher thermal acceleration and longer life for modern components compared to older ones. Accelerations for total test time in humidity are given, and the effect of assumed moisture ingress …

使用Hallberg-Peck（哈尔伯格-佩克）模型公式 计算PCT实验与 DH （双85 温度85℃、湿度85%）实验 时间换算. Hallberg-Peck模型是一种用于半导体器件的湿度和温度加速测试(如 uHAST)的模型。 这个模型扩展了传统的Peck模型，专门用于考虑湿度引起的加速老化效应。