Intel Unveils Industry-Leading Glass Substrates to Meet Demand …
2023年9月18日 · Glass substrates possess superior mechanical, physical and optical properties that allow for more transistors to be connected in a package, providing better scaling and enabling assembly of larger chiplet complexes (called “system-in-package”) compared to organic substrates in use today.
Glass Core Technology - Samtec
Samtec’s proprietary Glass Core Technology process leverages the performance benefits of glass to enable performance optimized, ultra-miniaturized substrates for next generation designs. These dimensions are guidelines designed to help release product to manufacturing as …
Intel Shows Off Work on Next-Gen Glass Core Substrates, Plans ...
2023年9月18日 · As a result of their progress with research and development on the glass cores, Intel is now planning on introducing glass core substrates to its products in the second half of this decade,...
The Role of Glass Core Substrate in 5G and AI Applications
2024年11月8日 · A Glass Core Substrate is an advanced material used in semiconductor packaging, designed to replace traditional organic substrates. Made from specialized glass, these substrates offer superior thermal resistance, mechanical stability, and low signal loss compared to organic materials like FR4 or BT.
Five facts you need to grasp to understand Intel’s glass substrate
2023年10月4日 · Intel has already demonstrated a fully functional test chip that uses 75-um through glass vias (TGVs) with a 20:1 aspect ratio and 1-mm core thickness (Figure 1). But what’s a glass substrate, and how does it differ from traditional …
Applicability of potential applications for glass material in semiconductor field. Where is glass required? Type of glass material used?
Next-Gen Intel Packaging with Glass Substrates ... - ServeTheHome
2023年9月18日 · The Glass Core Substrate will do things like improve power delivery and get high-efficiency I/O on the package. Intel also is planning a glass-based coupling with integrated waveguides for the pluggable co-packaged optics that were shown at Intel Innovation 2022 .
Glass Core substrates: the new race for advanced packaging giants
2024年6月17日 · Glass core substrates represent a promising frontier for advanced IC substrates and advanced packaging in general. They offer unparalleled performance and scalability for next-generation chip designs and packages.
• Glass substrates have ultra-low flatness for improved depth of focus for lithography. • Dimensional stability needed for extremely tight layer to layer interconnect overlay. • Up to 10x increase in interconnect density possible with glass.
The Race To Glass Substrates - Semiconductor Engineering
2024年5月29日 · Glass substrates ensure consistent focal plane alignment during lithography, enabling the creation of fine-pitch interconnects and intricate circuit patterns with superior accuracy and reproducibility.
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