2020年4月13日 · ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) is a type of surface plating applied on a Printed Circuit Board to protect it from environmental factors …

ENEPIG is frequently requested for applications requiring wire bonding as it demonstrates high wire bond pull strengths: aluminum wire up to 10g, gold wire up to 8g. It is also a very thin …

What is ENEPIG finish? ENEPIG is a type of surface finish done on a copper layer to protect it from corrosion and oxidation in printed circuit boards. It is suitable for high-density SMT designs.

2022年11月23日 · Though palladium is also a precious metal, ENEPIG is a cheaper surface finish for wire bonding. But in most cases, ENEPIG is more expensive because it has both gold and …

2024年10月17日 · ENEPIG is a high-performance PCB finish with nickel, palladium, and gold layers, offering superior solderability, corrosion resistance, and wire bonding for critical …

2024年9月23日 · ENEPIG stands for Electroless Nickel Electroless Palladium Immersion Gold. It differs from other finishes like ENIG (Electroless Nickel Immersion Gold) by including an …

ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) has emerged as an advanced plating finish for PCBs, providing excellent solderability while also resisting corrosion. This …

2025年3月8日 · ENEPIG is one of the most efficient finishes, and it gives excellent protection, solderability, and reliability over PCBs. It consists of layers: electroless nickel, palladium, and …

2024年1月6日 · ENEPIG, short for Electroless Nickel Electroless Palladium Immersion Gold, is an advanced PCB surface finish with a layered gold, palladium, and nickel structure. It overcomes …

2021年8月20日 · The Electroless Nickel Electroless Palladium Immersion Gold(ENEPIG) process is the earliest surface treatment process developed by Intel. By adding a palladium plating …