Our patented electrochemical plating technologies include multizone anodes for superior uniformity control, rubber-seal plating chucks for superior sealing, partial pulse plating for …

Experience the cutting-edge Electrochemical Plating (ECP) System for Advanced Packaging from ACM Research and boost manufacturing yield, efficiency, and cost savings.

The Ultra ECP GIII plating tool can support interconnect metal and wafer level packaging (WLP) for compound semiconductors, with product offerings for silicon carbide (SiC), galluium nitride …

Electrochemical plating (ECP) is presently the most popular method used for Cu deposition in semiconductor fabrication processes. This process technology has been introduced by NXP 4 …

2019年2月1日 · The prime objective of this paper is, to-root-cause uniformity troubleshooting by the adoption of integrated diffuser in electrochemical-plating (ECP) system optimizations. …

Introducing intentionally insoluble or sparingly soluble particulate matter with micron in size into conventional EP is called electroless composite plating (ECP). Studying ECP can understand …

Electrochemical plating (ECP) is a key process for copper via filling, which is required to achieving void-free and seam-free via filling, and with a minimized the copper overburden thickness. In …

2024年9月9日 · Ultra ECP 3d is integrated with ACM Research’s exclusive Multi-Anode Partial Plating function, which allows the deposition of Cu metal layer on via structures of 3D TSVs …

The microstructures of electrochemical plated (ECP) Cu films are investigated by various plating current and the rotation speed of wafer. Decreasing plating current increases the impurity …

Different electrochemical plating (ECP) processes were compared in terms of their surface profiles. Certain features sizes were found to be critical and specific pattern densities provide …