Riston® Laser Series Dry Film Photoresists Include: Riston® DI3000 series for T/E and P/E. Superior tenting capability – larger than 7mm round holes and 2*10 mm slot holes @38um FT; Excellent chemical resistance with no ragged line; Wide operation window by fine line capability; Capable with i-line & h-line multiple wavelength DI equipment

This paper describes the performance of several types of the most advanced Dry Film photo Resist (DFR), for producing high-density package substrates and chip on films (COF). 1) High resolution type DFR, which achieves very fine conductive patterns less than L/S=15/15um by semi-additive plating

MX Series Dry Film Photoresists provide uniform resist thickness across the entire wafer. DuPont MX Series dry film photoresists excel in etching and electroplating processes. These films are designed for RDL, TSV, lift-off, and MEMs applications, and are available in a range of 10-50 micron thicknesses. Product Benefits:

Riston® EtchMaster dry film photoresist is specifically designed as an acid etching film that delivers high yields in fine line applications. These photoresists provide excellent conformation using dry lamination and possess wide exposure, developing and stripping latitude.

Dry-film resists are usually sup- plied to customers in rolls ranging from 2“ to 60” wide and 125’ to 1,000' long. A typical roll is 18” X 500’ and 1.5 to 2 mils thick. The appropriate thickness de- pends on the function the resist must perform.

Riston® EtchMaster dry film photoresist is specifically designed as an acid etching film that delivers high yields in fine line applications. These photoresists provide excellent conformation …

In this study, dry film photoresist was patterned using UV lithography and the sidewall profile was optimized to achieve vertical sidewalls. Sidewall verticality of dry

Alfa Chemistry offers high-quality dry film photoresists for precise microfabrication applications, ensuring excellent resolution, uniform thickness, and versatility across various substrates and processes.

Dry film photoresist, also called dry film resist (DFR), refers to solid-state film photoresist. Among the three main products of printed circuit board (PCB) photoresist, the technical content of DFR is relatively higher than that of photosensitive solder resist ink and wet film photoresists.

High productive resist for rapid exposure, development and stripping and fine line innerlayer performance. Excellent tenting and plating resist with increased flexibility and productivity.