With the introduction of Lead-free solder, voiding within BGA joints is potentially a major issue during PCBA manufacture. With BGA components sometimes costing hundreds or even thousands of US Dollars, there has to be an understanding about when voiding within the joint is …
Generally, voids are gaseous inclusions within the solder joints containing organic substances. These inclusions may have different origins, but most of the macroscopic voids visible in X-ray analysis are caused by evaporation of solder flux
We compare three different plating methods for filling microvias, and then study the impact of these methods on the occurrence frequency and size of these voids. Three types of plating processes were analyzed: conformal plate (no via-fill), a one-step via-fill, and a two-step via-fill.
BGA Voids and Their Sources in SMT Assemblies : SMT Article
The IPC 7095 “Design and Assembly Process Implementation for BGA” committee has made significant changes in accept/reject criteria of voids. The revised version — IPC-7095 A — soon will be released with extensive changes in all aspects of BGA design and assembly.
Aspandiar characterized and classified BGA solder joint voids into several categories with assigned root causes that are widely utilized as ‘the’ industry void definition standard [4]. Macro voids have been the focus of the electronics industry for influencing solder joint integrity.
BGA Voiding: What’s Important? - Circuits Assembly
X-ray image of section of BGA with voids and an automated BGA void calculation. The ball at the bottom right has been calculated to have voiding of less than 15% but is highlighted in the data by setting a lower alarm threshold.
Voids in Ball Grid Array, BGA in SMT Assemblies : SMT Article
Voids near the printed circuit board (PCB)/ball interface during BGA attach typically are caused by improper reflow profile in which the flux is vaporized during the reflow process and entrapped during molten solder solidification.