The Thin Shrink Small Outline Package (TSSOP) is a rectangular surface mount plastic integrated circuit (IC) package with gull-wing leads.

Thin small outline package (TSOP) is a type of surface mount IC package. They are very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm). They are frequently used for RAM or Flash memory ICs due to their high pin count and small volume.

A thin small-outline package (TSOP) is a rectangular, thin-bodied component. A Type I TSOP has legs protruding from the width portion of the package.

Thin Shrink Small Outline Package (TSSOP) is a rectangular surface mount plastic integrated circuit (IC) package with gull-wing leads. They are suited for applications requiring 1 mm or less mounted height and are commonly used in analog and operation amplifiers, controllers and Drivers, Logic, Memory, and RF/Wireless, Disk drives, video/audio ...

Find the Small Outline (SO) package drawing and specifications such as pin count, pitch and dimension.

2025年1月2日 · 总结而言， SOP封装 及其衍生 封装 形式，如SO、 SOJ 、 SSOP 、 TSOP 和 TSSOP，各有其特点和应用领域。 作为电路设计者和制造者，应充分理解这些 封装 技术参数以及它们之间的差异，从而在实际工程应用中选择最适合的 封装 方案，... 该类型的 封装 于 1968 年由飞利浦公司开发，后来逐渐派生出 SOJ （J 型引脚小外形 封装）、 TSOP （薄小外形 封装） …

But, consider how modern electronics are always trying to be smaller, faster, and lighter, and you can see why one would use something like TSSOP, or even things like WL-CSP or BGA packages in their designs.

TSSOP-16 Minimum Packing Quantity Quantity Tape Width Part Number Suffix Bulk-Loose 96 — — 13” Reel 2,500 12mm -13 Note: Package quantities given are for minimum packaging quantity only, not minimum order quantity. For minimum order quantity, please contact Sales ...

The Thin Shrink Small Outline Package, or TSSOP, is a rectangular surface mount plastic package with gull-wing leads. It has a smaller body and smaller lead pitch than the standard SOIC package. It is also smaller and thinner than a TSOP with the same lead count.

TSSOP (Thin Shrink Small Outline Package) and MSOP (Mini Small Outline Package) are leadframe based, plastic encapsulated packages that are well suited for applications requiring less than 1 mm mounted height.