2022年2月22日 · NIPDAU/SN = NiPdAu over Sn (Nickel Palladium Gold over Tin plating. Since Gold (Au) is not soluble in Tin (Sn) or even tin-lead (SnPb), so the small amount of gold content from either pad or component can weaken the joint by creating elongated brittle crystals, which results in lower pull strengths.

2020年3月16日 · WSON (a type of DFN package) and the pins have a NiPdAu finish (this is compatible with both SnPb and lead free processes). WSBGA (a BGA package) which by definition will have solder balls and the solder balls are …

So after staring at a few ICs today, I was wondering what the "e3" or "e4" stands for on the top of an IC. For example, here is an e3:

2019年1月24日 · Aging studies have shown that NiPdAu lead finish devices pass solderability requirements beyond 8 years. Actual testing of LTS devices indicates that storage for 15 years does not compromise solderability. Moisture absorbed in the epoxy matrix of devices categorized as MSL 2 to 6 could vaporize during reflow solder assembly and crack the package.

SN74LS00DG4 Pb-Free + NiPdAu + ‘green’ mold compound part number That's also what timrorr refers to. Other differences in ordering codes may refer not just to the device package, but also how parts are delivered.

2017年9月20日 · Sn63/Pb37 is better than 60/40 because it is a eutectic alloy. That means it has the lowest melting point of any Sn/Pb alloy, and it solidifies relatively abruptly at one temperature rather than over a range.