证券之星消息，新益昌(688383)03月07日在投资者关系平台上答复投资者关心的问题。 投资者：请问公司半导体封装哪类架构的芯片 ...

AONDevices, a leader in super-low-power, high-accuracy edge AI solutions, is pleased to announce a strategic partnership with ...

LG Innotek's plan is to continue to enhance its Automotive AP Module. This year, it aims to increase the module's heat ...

PCBWay offer high-layer, high-order interposer PCB manufacturing services for more complex design, and even showcased a ...

Despite those woes, there's always been a bull case for the chip stock. It has long been a leader in the PC market. It's the largest integrated device manufacturer (IDM) in the U.S., meaning it ...

以下是其核心特点及市场表现的详细分析： 汉思底部填充胶采用单组份改性环氧树脂配方，专为BGA、CSP和Flip chip设计。通过加热固化，能填充芯片底部80%以上的空隙，显著提升芯片与基板间的抗跌落性能和机械强度，减少因温度膨胀系数（CTE）不匹配或外力冲击 ...

Microsoft unveiled a quantum-computing chip powered by exotic particles with unique properties. While the chip is just the first step on a long road to useful quantum computing, Microsoft's unique ...

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Microsoft today introduced Majorana 1, the world’s first quantum chip powered by a new Topological Core architecture that it expects will realize quantum computers capable of solving meaningful, ...

Microsoft says its quantum chip is less prone to errors than rivals Chip is a hybrid between semiconductors and superconductors Microsoft says chip has fewer qubits than rivals but easier to scale ...