Researchers can now fabricate a 3D chip with alternating layers of semiconducting material grown directly on top of each other. The method eliminates thick silicon substrates between the layers, ...

Researchers at the Massachusetts Institute of Technology have found a novel technique to create a multilayered chip with ...

电子堆叠技术可以成倍地增加芯片上的晶体管数量，从而实现更高效的人工智能硬件。

电子堆叠技术可以成倍增加芯片上的晶体管数量，从而实现更高效的人工智能硬件。当前，电子工业正在接近计算机芯片表面所能容纳的晶体管数量的极限。因此，芯片制造商正在寻求建立而不是向外发展。该行业的目标不是将越来越小的晶体管挤在一个表面上，而是将晶体管和半导 ...

The study's MIT co-authors include first author Ki Seok Kim, Seunghwan Seo, Doyoon Lee, Jung-El Ryu, Jekyung Kim, Jun Min Suh ...