2.5D封装以其高带宽、低功耗和高集成度的优势，成为了AI芯片的理想封装方案。 在2.5D封装领域，英特尔的EMIB和台积电的CoWoS是两大明星技术。

多年来，封装技术并未受到大众的广泛关注。但是现在，尤其是在 AI 芯片的发展过程中，封装技术发挥着至关重要的作用。2.5D 封装以其高带宽、低功耗和高集成度的优势，成为了 AI 芯片的理想封装方案。 在 2.5D 封装领域，英特尔的 EMIB 和台积电的 CoWoS 是两大 ...

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Oh!are the monsters that duelists use in each of the anime. Naturally, the monsters with the best designs are the ones that ...

At close: March 28 at 5:07:00 PM GMT-3 ...