which ionizes the precursor gas molecules and creates a highly reactive environment. PECVD can be performed at lower temperatures compared to thermal CVD, making it suitable for heat-sensitive ...

The Cobra ® ICP plasma source generates high-density reactive species at low pressure ... module has been developed to produce high-quality films from room temperature to 400 °C with high-density ...

Reactive Ion Etch (RIE) is a physical etch process. A rich plasma has been made just above the wafer, and the ions are expedited toward the surface to generate a highly powerful anisotropic etch.

The laser wavelength, pulse duration, and fluence (energy density) significantly influence the ablation process and the resulting plasma plume. Shorter wavelengths and higher fluences generally lead ...

Pulsed laser deposition (PLD) involves a laser ablation procedure, where a laser pulse interacts with a material surface to induce the formation of a plasma plume that expands away from the surface.