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苹果M5芯片舍弃2nm选3nm,SoIC封装技术能否带来性能大飞跃?
据悉,该芯片将采用台积电的SoIC封装技术,即集成片上系统。这一技术是台积电最新的封装方案,通过创新的多芯片堆叠技术,将多个芯片垂直堆叠 ...
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