Raspberry Pi has announced the general availability of the RP2350 A and B, the SoC that powers the Raspberry Pi Pico 2 which ...

In this case an FTDI chip had been designed with a PCB footprint for a QFN package when the only chip to be found was a QFP from a breakout board. The three boards which make up the adapter For ...

The BG29 is available in compact quad flat no-lead (QFN) and wafer-level chip scale packages (WLCSP), featuring substantial ...

Silicon Labs unveils the ultra-low-power BG29 Bluetooth wireless SoCs with expanded memory at Embedded World 2025.

Vishay Intertechnology, Inc. (NYSE: VSH) today announced that it has upgraded its VSOP383xx series of preamplifier circuits for infrared (IR) remote control applications in consumer products with the ...

The company's ultra-small BG29 with expanded memory and ultra-low power is ideal for connected health devices and tiny ...

Ultra-small BG29 with expanded memory and ultra-low power is ideal for Connected Health devices AUSTIN, Texas, /PRNewswire/ ...

It was special because the original NES custom DIP chips had been sanded down to something like a surface-mount QFN package. Back when our colleague [Arya] wrote up the project there wasn’t much ...

The BG29 is available in compact quad flat no-lead (QFN) and wafer-level chip scale packages (WLCSP), featuring substantial memory with significant RAM and Flash capacities. These extended memory ...