These four lasers are fabricated by bonding a layer of indium phosphide to the silicon photonic chip. The specific laser wavelengths are determined by etching lithographically defined grating ...

GlobalFoundries announces plans to create a new centre for advanced packaging and testing of US-made essential chips.

Chip manufacturing giant GlobalFoundries has announced plans to spend upwards of $700 million establishing a new silicon photonics facility at its existing upstate New York location. Headquartered in ...

One possible approach involves a combination of flip-chip bonding of InP die on a silicon nitride carrier material with novel laser soldering, as described in a June 2023 paper co-authored by Santos ...

GlobalFoundries (GF) has announced plans to build an Advanced Packaging and Photonics Center in the state of New York, USA.

US foundry GlobalFoundries Inc. has said it plans to create a center for advanced packaging and test of chips within its New ...

Silicon photonics chips are also positioned to address power and performance needs in automotive ... New production capabilities for the advanced packaging, wafer-to-wafer bonding, assembly and ...

Hybrid or heterogeneous integration solutions, such as flip-chip, micro-transfer printing or die-to-wafer bonding ... selectively on large-size silicon photonics wafers remains a highly sought ...

The lack of highly scalable, native CMOS-integrated light sources has been a major roadblock for the widespread adoption of silicon photonics. Hybrid or heterogeneous integration solutions, such as ...

Nvidia and TSMC have developed a silicon photonics-based chip prototype, according to a recent report from the Taiwanese press. Silicon photonics merges photonic circuits with traditional ...

The collaboration will drive broad adoption and accelerate the integration of silicon photonics chips for datacom, AI, sensing, LiDAR technologies, quantum computing and consumer applications markets.