If there's one topic that's guaranteed to cause a heated discussion amongst PC enthusiasts, it's thermal paste ... Some liquid metal compounds are even colloids, with microscopic copper grains ...

The big picture: Element Six has introduced a copper-plated diamond composite material designed to address increasing thermal management challenges in advanced semiconductor devices. By lowering ...

By cladding the copper pillars with graphene, this material improves heat transfer by 60%, while preventing oxidation of the metal. While the challenge is obviously to transfer these findings to ...