Extreme-ultraviolet (EUV) lithography at 13.5 nm is expected to be introduced in high-volume semiconductor chip production over the next three years. Research is now underway to investigate sub-10 ...

By controlling the orientation and stacking of block copolymer domains, intricate 3D architectures can be created, offering new opportunities for the fabrication of advanced nanomaterials and devices.

Micro and sub-micro features with a range of aspect ratio were prepared by lithography. Atomic force, confocal optical, and scanning electron microscopy were used for characterization. The flexible ...