One of the most complex parts of this process is lithography: the step in which shapes are drawn onto a silicon wafer. There are several ways to do this, all of them rather complicated ...

Extreme-ultraviolet (EUV) lithography at 13.5 nm is expected to be introduced in high-volume semiconductor chip production over the next three years. Research is now underway to investigate sub-10 ...

Extreme ultraviolet (EUV) lithography is the next step in this trend. It uses radiation of wavelength 13.5 nm, thereby offering significant potential to extend the resolution of photolithography ...

The Elionix ELS-G100 electron beam lithography system produces a highly stable beam with a diameter as small 1.8nm, using acceleration voltages of up to 100kV and high beam currents. This allows fine ...

EUV, extreme ultraviolet lithography, is nearly completely associated with the Dutch company ASML, the only maker of EUV machines that are used by TSMC, Intel and other chip manufacturers of advanced ...

A research partnership led by Lawrence Livermore National Laboratory (LLNL) has been formed to investigate the next evolution of extreme ultraviolet (EUV) lithography. The team will participate in the ...

Working at i-line (λ=364nm), with standard novolak resists, we have demonstrated features as small as 50 nm. The processing has been developed and demonstrated with an interferometric lithography tool ...