Laser ablation results in smaller chipping on both the top and bottom sides of the die, as well as a narrower kerf width.
Now, joined by its recently acquired subsidiary, Control Micro Systems, Inc. (CMS), LPC has expanded its product line of advanced laser wafer dicing, marking, and scribing technologies.
Fonon Well-Positioned To Capitalize on Wafer Dicing Market Growth With BlackStar Laser Dicing System
The success of wafer dicing is measured by the quality and yield of the separated chips and the overall efficiency of the process. Powered by Fonon’s patented Fantom Width Laser Dicing (FWLD) ...
Wayne Tupuola, CEO of LPC, stated, “For Laser Photonics, IEDM is an excellent platform to present our state-of-the-art solutions for dicing and marking of silicon, sapphire and compounds.
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