Laser ablation results in smaller chipping on both the top and bottom sides of the die, as well as a narrower kerf width.

ORLANDO, Fla.–(BUSINESS WIRE)–Fonon, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for subtractive and additive ...

(CMS), LPC has expanded its product line of advanced laser wafer dicing, marking, and scribing technologies. One of LPC’s flagship products in this space is the BlackStar laser wafer dicing and ...

Wayne Tupuola, CEO of LPC, stated, “For Laser Photonics, IEDM is an excellent platform to present our state-of-the-art solutions for dicing and marking of silicon, sapphire and compounds.