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13 天
LG Innotek进军车用半导体市场 推出车用应用处理器模块
LG Innotek计划到2030年时,其半导体组件业务的年销售额将成长到30亿美元,主要基于FC-BGA(覆晶球门阵列)、RF-SiP(射频系统级封装)和车用AP模块等高价值半导体基板。
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