The Korea Research Institute of Standards and Science (KRISS, President Ho Seong Lee) has successfully developed a high-quality compound semiconductor material for ultra-sensitive SWIR sensors.

Amid intensifying competition in advanced semiconductor packaging, Samsung Electronics is reportedly taking direct control of ...

Glass substrates are also considered the most suitable technology for the application of chiplet packaging, which is seen as a future technology in the semiconductor market. Chiplets allow for ...

FREMONT, Calif.--(BUSINESS WIRE)--AXT, Inc. (NasdaqGS: AXTI), a leading manufacturer of compound semiconductor substrates, will announce its financial results for the fourth quarter 2024 in a ...

India is accelerating its semiconductor ambitions with a new SiC fab by Indichip Semiconductors and Yitoa Micro Technology in Andhra Pradesh, backed by a US$1.68 billion investment.