Integrating multiple chiplets within a single package has become crucial for high-performance computing. CoMira’s UCIe (Universal Chiplet Interconnect Express) IP solution bridges the gap in ...

14, 2025 /PRNewswire/ -- MZ Technologies, a leading supplier of innovative solutions and methodologies for 2.5 and 3D design, today unveiled GENIO EVO, the first integrated chiplet/package EDA ...