MIT’s high-rise 3D chips pave the way for denser semiconductors, boosting density and reshaping AI, IoT, and next-gen ...

Milpitas, Calif., April 26, 2012 – GLOBALFOUNDRIES today announced a significant milestone on the road to enabling 3D stacking of chips for next-generation mobile and consumer applications. At its Fab ...

The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.

The new 3D stack resembles as close as possible to future commercial chips. It consists of a 25µm thick logic die on top of which a commercial DRAM is stacked using through-silicon vias (TSVs) and ...

AMD's next-generation UDNA GPU architecture will be fabbed on TSMC N3E, new flagship Radeon GPU is in development, leaker ...

OKI (TOKYO: 6703), in collaboration with Nisshinbo Micro Devices Inc. (Head office: Tokyo; President: Keiichi Yoshioka), has ...

The PS6 is expected to use AMD's 3D stacked chips, with the chip manufacturer's next-gen UDNA lineup entering mass production ...

But as we look toward the end of the decade, it seems likely that the world will see the emergence of 3D monolithic stacked DRAM. The only questions that remain are what form it will take and when ...

Kim’s team did both, building a 3D chip out of vertically stacked 2D semiconductors. Graphene, a single-atom-thin sheet of carbon, is probably the most famous 2D material, but it's not a ...

It enables chip designers to build system-in-packages (SiPs) of 3D-stacked logic, network and I/O chiplets, and HBM memory stacks. The platform allows for SiPs with up to 6000mm² of 3D-stacked ...